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A question on MD Nastran Stanford Edition

Pranav D. Shah's picture
Posted in

I have created a thread for a question raised by Yuval as follows:

Pranav,

Is the MD Nastran Stanford edition can be considered as a standard edition of MD Nastran?

I have looked at Nastran's homepage and noticed that failure analysis is available only in the MD Nastran professional edition. Do you use MD Nastran's failure analysis or just use it as a FE solver?

Dr. Yuval Freed, Ph.D.
Israel Aerospace Industries
Engineering Center, Dept. 4444
Tel: +972-3-9359668
Fax: +972-3-9355055
e-mail: yfreed@iai.co.il

MD-Nastran Edition for Stanford

Kim Parnell's picture

MD-Nastran Edition for Stanford is a full-featured version of our software from the MSC University software bundle. It includes MD-Nastran, MSC.MARC, and MSC.Patran. MD-Nastran Edition for Stanford is only limited by size (5000 nodes) and has a limited-time license that will end after the Tutorial. We will use the MD-Nastran composite modeling and general finite element analysis capability in conjunction with Mic-Mac-FEA. We are also working to develop some workshop demonstrations around the more advanced capabilities like delamination, progressive failure, and fracture of composites. In the current Tutorial #4, I (Kim Parnell) will be giving a presentation on these topics in the May 12, 2009 session.

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T. Kim Parnell, Ph.D.,P.E.
PEC - Parnell Engineering and Consulting
Sunnyvale, CA 94087
E-mail: kim.parnell@stanfordalumni.org
http://www.parnell-eng.com
http://www.linkedin.com/in/parnellpec
Skype: kim.parnell_msc

A question on MD Nastran Stanford Edition

Kim Parnell's picture

MD-Nastran Edition for Stanford is a full-featured version of our software from the MSC University software bundle. It includes MD-Nastran, MSC.MARC, and MSC.Patran. MD-Nastran Edition for Stanford is only limited by size (5000 nodes) and has a limited-time license that will end after the Tutorial. We will use the MD-Nastran composite modeling and general finite element analysis capability in conjunction with Mic-Mac-FEA. We are also working to develop some workshop demonstrations around the more advanced capabilities like delamination, progressive failure, and fracture of composites. In the current Tutorial #4, I (Kim Parnell) will be giving a presentation on these topics in the May 12, 2009 session.

-----------------
T. Kim Parnell, Ph.D.,P.E.
PEC - Parnell Engineering and Consulting
Sunnyvale, CA 94087
E-mail: kim.parnell@stanfordalumni.org
http://www.parnell-eng.com
http://www.linkedin.com/in/parnellpec
Skype: kim.parnell_msc